WIFI ESP8266-12F

177

Advancement plan, there are new forward leaps, in light of ESP-12E.The new four-layer board plan, the new modification recieving wire RF execution improvement, correspondence distance is expanded by 30% – half contrasted with ESP-12E !Semi-opening chip innovation, the entire IO leads, with metal protecting shell.Built-board PCB radio wire, 4M bytes Flash.Pins and impression are completely Viable with ESP-12E and our pertinent breakout board.

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Advancement plan, there are new forward leaps, in light of ESP-12E.The new four-layer board plan, the new modification recieving wire RF execution improvement, correspondence distance is expanded by 30% – half contrasted with ESP-12E !Semi-opening chip innovation, the entire IO leads, with metal protecting shell.Built-board PCB radio wire, 4M bytes Flash.Pins and impression are completely Viable with ESP-12E and our pertinent breakout board.

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